CYTEC ENGINEERED MATERIALS, INC. - MOLDING COMPOUND
Key Details
Description
MOLDING COMPOUND
Context & Analysis
On Oct 14, 2025, Department of Defense obligated $341,066.56 to CYTEC ENGINEERED MATERIALS, INC. for molding compound. The award is classified under NAICS 325199 — ALL OTHER BASIC ORGANIC CHEMICAL MANUFACTURING and issued as a firm fixed price contract. Competition extent: not competed under sap with 1 offer received. The procurement used a NO SET ASIDE USED. set-aside. Performance is located in WINONA, MN. This award is one of several similar procurements from Department of Defense under NAICS 325199 — related awards are listed below.
Contractor Information
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