FIRM FIXED PRICENO SET ASIDE USED.
CYTEC ENGINEERED MATERIALS, INC. - MOLDING COMPOUND
PIID: N6893626P5008Solicitation ID: N6893625Q5171
Signed Date: Oct 14, 2025Effective Date: Oct 14, 2025End Date: Closed on Feb 10, 2026
Award $
$341K
Vendor
CYTEC ENGINEERED MATERIALS, INC.
NAICS
325199
Signed Date
Oct 14, 2025
Key Details
Description
MOLDING COMPOUND
Context & Analysis
On Oct 14, 2025, Department of Defense obligated $341,066.56 to CYTEC ENGINEERED MATERIALS, INC. for molding compound. The award is classified under NAICS 325199 — ALL OTHER BASIC ORGANIC CHEMICAL MANUFACTURING and issued as a firm fixed price contract. Competition extent: not competed under sap with 1 offer received. The procurement used a NO SET ASIDE USED. set-aside. Performance is located in WINONA, MN.
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