This contract expires in 200 days (Mar 31, 2027).

HX5 LLC - THIS TO IS FOR THE FABRICATION AND THERMAL ANALYSIS OF TWO "RFMG 3.1" EDU CIRCUIT BOARDS, WHICH WILL BE COMPRISED OF COMMERCIAL GRADE ELECTRONIC PARTS.

PIID: 80GRC023F0119

Signed Date: Sep 27, 2023Effective Date: Oct 1, 2023End Date: Closes in 200 days

Award $

$574K

Vendor

HX5 LLC

NAICS

541715

Signed Date

Sep 27, 2023

Key Details

Dollars Obligated

$573,795.61

Base & All Options

$637,971.7

Awarding Agency

National Aeronautics and Space Administration

Awarding Sub-Agency

National Aeronautics and Space Administration

NAICS Code

541715 - RESEARCH AND DEVELOPMENT IN THE PHYSICAL, ENGINEERING, AND LIFE SCIENCES (EXCEPT NANOTECHNOLOGY AND BIOTECHNOLOGY)

Parent IDIQ (PIID)

80GRC020D0003

Product Service Code

R408 - SUPPORT- PROFESSIONAL: PROGRAM MANAGEMENT/SUPPORT

Extent Competed

FULL AND OPEN COMPETITION AFTER EXCLUSION OF SOURCES

Place of Performance

CLEVELAND, OH

Description

THIS TO IS FOR THE FABRICATION AND THERMAL ANALYSIS OF TWO "RFMG 3.1" EDU CIRCUIT BOARDS, WHICH WILL BE COMPRISED OF COMMERCIAL GRADE ELECTRONIC PARTS.

Context & Analysis

On Sep 27, 2023, National Aeronautics and Space Administration obligated $573,795.61 to HX5 LLC for this to is for the fabrication and thermal analysis of two "rfmg 3.1" edu circuit boards, which will be comprised of commercial grade electronic parts.. The award is classified under NAICS 541715 — RESEARCH AND DEVELOPMENT IN THE PHYSICAL, ENGINEERING, AND LIFE SCIENCES (EXCEPT NANOTECHNOLOGY AND BIOTECHNOLOGY). Competition extent: full and open competition after exclusion of sources. Performance is located in CLEVELAND, OH. The contract is scheduled through Mar 31, 2027 — approximately 7 months remaining.