This contract expires in 174 days (Nov 30, 2026).

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FIRM FIXED PRICENO SET ASIDE USED.

LEICA MICROSYSTEMS INC. - BOND MAX PROCESSING MODULE - SILVER SERVICE - PREVENTIVE MAINTENANCE

PIID: 36C25024P0257Solicitation ID: 36C25024Q0045
Signed Date: Dec 1, 2025Effective Date: Dec 1, 2023End Date: Closes in 174 days
Award $
$54K
Vendor
LEICA MICROSYSTEMS INC.
NAICS
811210
Signed Date
Dec 1, 2025

Key Details

Dollars Obligated
$53,998.65
Base & All Options
Awarding Sub-Agency
Department of Veterans Affairs
Product Service Code
J065 - MAINT/REPAIR/REBUILD OF EQUIPMENT- MEDICAL, DENTAL, AND VETERINARY EQUIPMENT AND SUPPLIES
Extent Competed
NOT COMPETED UNDER SAP
Number of Offers
1
Place of Performance
DETROIT, MI, 482013193, CD-MI-13

Description

BOND MAX PROCESSING MODULE - SILVER SERVICE - PREVENTIVE MAINTENANCE

Context & Analysis

On Dec 1, 2025, Department of Veterans Affairs obligated $53,998.65 to LEICA MICROSYSTEMS INC. for bond max processing module - silver service - preventive maintenance. The award is classified under NAICS 811210 — ELECTRONIC AND PRECISION EQUIPMENT REPAIR AND MAINTENANCE and issued as a firm fixed price contract. Competition extent: not competed under sap with 1 offer received. The procurement used a NO SET ASIDE USED. set-aside. Performance is located in DETROIT, MI. The contract is scheduled through Nov 30, 2026 — approximately 6 months remaining.

Contractor Information

UEI: VN38G4R6FUB9
CAGE Code: 0F735
Location: DEERFIELD, IL
View Full Record on USASpending.gov

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