This contract expires in 210 days (Jan 4, 2027).

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FIRM FIXED PRICENO SET ASIDE USED.

LEICA MICROSYSTEMS INC. - LEICA BOND-MAX PM SERVICE B+4

PIID: 36C26024P0102Solicitation ID: 36C26024Q0063
Signed Date: Jan 16, 2026Effective Date: Jan 5, 2024End Date: Closes in 210 days
Award $
$54K
Vendor
LEICA MICROSYSTEMS INC.
NAICS
811210
Signed Date
Jan 16, 2026

Key Details

Dollars Obligated
$53,998.62
Base & All Options
Awarding Sub-Agency
Department of Veterans Affairs
Product Service Code
J066 - MAINT/REPAIR/REBUILD OF EQUIPMENT- INSTRUMENTS AND LABORATORY EQUIPMENT
Extent Competed
COMPETED UNDER SAP
Number of Offers
1
Place of Performance
BOISE, ID, 837024501, CD-ID-02

Description

LEICA BOND-MAX PM SERVICE B+4

Context & Analysis

On Jan 16, 2026, Department of Veterans Affairs obligated $53,998.62 to LEICA MICROSYSTEMS INC. for leica bond-max pm service b+4. The award is classified under NAICS 811210 — ELECTRONIC AND PRECISION EQUIPMENT REPAIR AND MAINTENANCE and issued as a firm fixed price contract. Competition extent: competed under sap with 1 offer received. The procurement used a NO SET ASIDE USED. set-aside. Performance is located in BOISE, ID. The contract is scheduled through Jan 4, 2027 — approximately 7 months remaining.

Contractor Information

UEI: VN38G4R6FUB9
CAGE Code: 0F735
Location: DEERFIELD, IL

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