MATCHID US INC - CHIPS R&D: 3D DIGITAL IMAGE CORRELATION (3D-DIC) SOFTWARE PACKAGE
Key Details
Description
CHIPS R&D: 3D DIGITAL IMAGE CORRELATION (3D-DIC) SOFTWARE PACKAGE
Context & Analysis
Department of Commerce obligated $171,420.69 to MATCHID US INC for chips r&d: 3d digital image correlation (3d-dic) software package. The award is classified under NAICS 518210 and issued as a purchase order contract. The contract is scheduled through Oct 27, 2027. This award is one of several similar procurements from Department of Commerce under NAICS 518210 — related awards are listed below.
Contractor Information
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