FIRM FIXED PRICENO SET ASIDE USED.
PARK AEROSPACE CORP. - CARBON PHENOLIC MOLDING COMPOUND
PIID: N6893625P5299
Signed Date: Oct 28, 2025Effective Date: Sep 29, 2025End Date: Closed on Dec 15, 2025
Award $
$233K
Vendor
PARK AEROSPACE CORP.
NAICS
325211
Signed Date
Oct 28, 2025
Key Details
Description
CARBON PHENOLIC MOLDING COMPOUND
Context & Analysis
On Oct 28, 2025, Department of Defense obligated $233,370 to PARK AEROSPACE CORP. for carbon phenolic molding compound. The award is classified under NAICS 325211 — PLASTICS MATERIAL AND RESIN MANUFACTURING and issued as a firm fixed price contract. Competition extent: not competed under sap with 1 offer received. The procurement used a NO SET ASIDE USED. set-aside. Performance is located in WESTBURY, NY. This award is one of several similar procurements from Department of Defense under NAICS 325211 — related awards are listed below.
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