SIENNA TECHNOLOGIES, INC. - HF2C SIC PRESSURE-TEMPERATURE SENSORS PACKAGING
Key Details
Description
HF2C SIC PRESSURE-TEMPERATURE SENSORS PACKAGING
Context & Analysis
On Dec 2, 2025, National Aeronautics and Space Administration obligated $143,750 to SIENNA TECHNOLOGIES, INC. for hf2c sic pressure-temperature sensors packaging. The award is classified under NAICS 335999 — ALL OTHER MISCELLANEOUS ELECTRICAL EQUIPMENT AND COMPONENT MANUFACTURING and issued as a firm fixed price contract. Competition extent: not competed under sap with 1 offer received. The procurement used a NO SET ASIDE USED. set-aside. Performance is located in WOODINVILLE, WA. This award is one of several similar procurements from National Aeronautics and Space Administration under NAICS 335999 — related awards are listed below.
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