SIENNA TECHNOLOGIES, INC. - MULTI-CHIP MODULE PACKAGING OF SIC PRESSURE SENSORS AND ELECTRONICS

On Nov 14, 2025, National Aeronautics and Space Administration obligated $65,500 to SIENNA TECHNOLOGIES, INC. for multi-chip module packaging of sic pressure sensors and electronics. The award is classified under NAICS 334419 — OTHER ELECTRONIC COMPONENT MANUFACTURING and issued as a firm fixed price contract. Competition extent: competed under sap with 1 offer received. The procurement used a NO SET ASIDE USED. set-aside. Performance is located in MUKILTEO, WA. This award is one of several similar procurements from National Aeronautics and Space Administration under NAICS 334419 — related awards are listed below.