FIRM FIXED PRICENO SET ASIDE USED.

SIENNA TECHNOLOGIES, INC. - MULTI-CHIP MODULE PACKAGING OF SIC PRESSURE SENSORS AND ELECTRONICS

PIID: 80NSSC24PC199Solicitation ID: 80NSSC24881222Q
Signed Date: Nov 14, 2025Effective Date: Aug 26, 2024End Date: Closed on Mar 31, 2026

Key Details

Dollars Obligated
$65,500
Base & All Options
Awarding Sub-Agency
National Aeronautics and Space Administration
Product Service Code
H299 - EQUIPMENT AND MATERIALS TESTING- MISCELLANEOUS
Extent Competed
COMPETED UNDER SAP
Number of Offers
1
Place of Performance
MUKILTEO, WA, 982754255, CD-WA-02

Description

MULTI-CHIP MODULE PACKAGING OF SIC PRESSURE SENSORS AND ELECTRONICS

Contractor Information

UEI: W8VZALJ8J617
CAGE Code: 084Z5
Location: MUKILTEO, WA
View Full Record on USASpending.gov

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