SIENNA TECHNOLOGIES, INC. - SILICON NITRIDE FOR SENSOR PACKAGING FOR HIGH TEMPERATURE APPLICATIONS

On Feb 27, 2026, National Aeronautics and Space Administration obligated $136,040 to SIENNA TECHNOLOGIES, INC. for silicon nitride for sensor packaging for high temperature applications. The award is classified under NAICS 541715 — RESEARCH AND DEVELOPMENT IN THE PHYSICAL, ENGINEERING, AND LIFE SCIENCES (EXCEPT NANOTECHNOLOGY AND BIOTECHNOLOGY) and issued as a firm fixed price contract. Competition extent: not competed under sap with 1 offer received. The procurement used a NO SET ASIDE USED. set-aside. Performance is located in MUKILTEO, WA. The contract is scheduled through Jul 3, 2026 — approximately 1 month remaining.