This contract expires in 342 days (Sep 30, 2027).

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NO SET ASIDE USED.

THE PENNSYLVANIA STATE UNIVERSITY - LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS)

PIID: 140D0424C0065Solicitation ID: HR001123S0051
Signed Date: Jul 31, 2024Effective Date: Aug 1, 2024End Date: Closes in 342 days
Award $
$6.3M
Vendor
THE PENNSYLVANIA STATE UNIVERSITY
NAICS
541715
Signed Date
Jul 31, 2024

Key Details

Dollars Obligated
$6.3M
Base & All Options
$6.3M
Awarding Sub-Agency
Departmental Offices
Product Service Code
AJ12 - GENERAL SCIENCE AND TECHNOLOGY R&D SERVICES; GENERAL SCIENCE AND TECHNOLOGY; APPLIED RESEARCH
Extent Competed
FULL AND OPEN COMPETITION
Number of Offers
25
Place of Performance
UNIVERSITY PARK, PA

Description

LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS)

Context & Analysis

On Jul 31, 2024, Department of the Interior obligated $6,301,511 to THE PENNSYLVANIA STATE UNIVERSITY for large area, high quality electronic grade diamond via innovative seed cloning and tiling processes for ultra-wide bandgap semiconductors (uwbgs). The award is classified under NAICS 541715 — RESEARCH AND DEVELOPMENT IN THE PHYSICAL, ENGINEERING, AND LIFE SCIENCES (EXCEPT NANOTECHNOLOGY AND BIOTECHNOLOGY). Competition extent: full and open competition with 25 offers received. The procurement used a NO SET ASIDE USED. set-aside. Performance is located in UNIVERSITY PARK, PA. The contract is scheduled through Sep 30, 2027 — approximately 11 months remaining. This award is one of several similar procurements from Department of the Interior under NAICS 541715 — related awards are listed below.

Contractor Information

UEI: NPM2J7MSCF61
Location: UNIVERSITY PARK, PA

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